Sotabase

Career

· Research Intern, CPU Formal Verification team, Apple Inc.2022–2022
· Research Assistant, Dr. Yu-Fang Chen's group, Academia Sinica, Institute of Information Science2020–2020
· Research Assistant, Stanford University2020–

Publications (40)

Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned Copper
Science · 2012
355
cited
Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy
Microelectronics and reliability · 2013
174
cited
Thermomigration in solder joints
2012
145
cited
Fabrication and Characterization of (111)-Oriented and Nanotwinned Cu by Dc Electrodeposition
2012
110
cited
Thermomigration in Pb-free SnAg solder joint under alternating current stressing
2009
60
cited
Thermomigration in flip-chip SnPb solder joints under alternating current stressing
2007
56
cited
The effect of a concentration gradient on interfacial reactions in microbumps of Ni/SnAg/Cu during liquid-state soldering
2012
46
cited
Extremely anisotropic single-crystal growth in nanotwinned copper
2014
43
cited
Synthesizing Formal Models of Hardware from RTL for Efficient Verification of Memory Model Implementations
Micro · 2021
23
cited
Direct measurement of hot-spot temperature in flip-chip solder joints under current stressing using infrared microscopy
2008
21
cited
Inhibiting the consumption of Cu during multiple reflows of Pb-free solder on Cu
2011
21
cited
Stress Analysis and Design Optimization for Low- $k$ Chip With Cu Pillar Interconnection
IEEE Transactions on Components, Packaging, and Manufacturing Technology · 2015
21
cited
Comparison of the electromigration behaviors between micro-bumps and C4 solder bumps
Electronic Components and Technology Conference · 2011
17
cited
Ultra-Thin FO Package-on-Package for Mobile Application
Electronic Components and Technology Conference · 2019
14
cited
Electromigration reliability and morphologies of Cu pillar with microbump under high current density stressing
Electronic Packaging Technology Conference · 2015
9
cited
Failure Mechanism for Fine Pitch Microbump in Cu/Sn/Cu System During Current Stressing
IEEE Transactions on Components, Packaging, and Manufacturing Technology · 2015
8
cited
Laser drilling and Plasma Cleaning Process for Blind Via Through Mold Interconnect
Electronic Packaging Technology Conference · 2020
8
cited
Thermal Compression Bonding of 30um Pitch Cu Pillar Microbump on Organic Substrate with Bare Cu Bondpad
Electronic Components and Technology Conference · 2016
8
cited
Through mold interconnects for fan-out wafer level package
Electronic Packaging Technology Conference · 2016
8
cited
Laser de-bonding process development of glass substrate for Fan-out wafer level packaging
Electronic Packaging Technology Conference · 2016
7
cited
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Yao Hsiao | Researcher Profile | Sotabase | Sotabase