Sotabase

Career

· Associate Professor and Bloomberg Chair, UC Berkeley Graduate School of Journalism2023–

Publications (27)

Statistical analysis of electromigration lifetimes and void evolution
2004
65
cited
Statistical analysis of early failures in electromigration
2001
61
cited
Electromigration of Cu-Sn-Cu micropads in 3D interconnect
Electronic Components and Technology Conference · 2008
29
cited
Analysis of electromigration statistics for Cu interconnects
2006
20
cited
Large-scale statistical analysis of early failures in Cu electromigration, Part I: Dominating mechanisms
2010
17
cited
Detection and analysis of early failures in electromigration
2000
16
cited
Blech effect in single-inlaid Cu interconnects
Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461) · 2001
13
cited
Electromigration failure model: its application to W plug and Al-filled vias
1998
13
cited
Electromigration early failure distribution in submicron interconnects
Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247) · 1999
10
cited
Examination of Critical Length Effect in Copper Interconnects With Oxide and Low‐k Dielectrics
2004
9
cited
Large-scale statistical analysis of early failures in Cu electromigration, Part II: Scaling behavior and short-length effects
2010
8
cited
Statistical evaluation of device-level electromigration reliability
1998
8
cited
The influence of process parameters on electromigration lifetime statistics
2008
7
cited
Chip‐Level Electromigration Reliability for Cu Interconnects
2004
6
cited
Large‐Scale Statistical Study of Electromigration Early Failure for Cu/low‐k Interconnects
2007
6
cited
Scaling of Statistical and Physical Electromigration Characteristics in Cu Interconnects
2006
6
cited
Dependence of EM performance on linewidth for Cu dual-inlaid structures
Other Conferences · 2000
4
cited
Thermal stresses in Cu damascene submicron line structures
1999
4
cited
Critical Length and Resistance Saturation Effects in Al(Cu) Interconnects
1998
3
cited
Electromigration failure modes and Blech effect in single-inlaid Cu interconnects
Other Conferences · 2000
3
cited
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