Sotabase

Career

· Software Engineer Intern, GEICO2025–2025
· Master's, Computer Science, University of Illinois Urbana-Champaign2025–2026
· Software Engineer Intern, Acceldata2024–2024
· Full Time Project Manager, OTCR Consulting2024–2024
· Partner, OTCR Consulting2024–2024
· Freshman Spearhead, Illinois Business Council2023–2023
· New Member, Illinois Business Council2022–2022
· Retail Sales Associate, Nike2022–2022
· Consultant, OTCR Consulting2022–2023
· Bachelor's degree, Computer Science, University of Illinois Urbana-Champaign2022–2025
· CS Research Assistant, University of Illinois Urbana-Champaign2021–2024
· Data Science Mentor, DIYA Research Inc.2020–2023
· Summer Intern, The Hive, LLC2019–2019

Publications (13)

Thermal performance enhancement in heat exchangers using active and passive techniques: a detailed review
Journal of Thermal Analysis and Calorimetry · 2022
93
cited
Practical chip-centric electro-thermal simulations
2008 14th International Workshop on Thermal Inveatigation of ICs and Systems · 2008
20
cited
Fine grain thermal modeling and experimental validation of 3D-ICs
Microelectronics Journal · 2011
19
cited
A 1024 Pin Universal Interconnect Array With Routing Architecture
Proceedings of the IEEE Custom Integrated Circuits Conference · 1992
18
cited
Junction-level thermal extraction and simulation of 3DICs
IEEE International Conference on 3D System Integration · 2009
18
cited
Fine grain thermal modeling of 3D stacked structures
International Workshop on Thermal Investigations of ICs and Systems · 2009
11
cited
System Design of a Novel Combined Cooling, Heat, Power, and Water Microturbine Combined Cycle
2008
8
cited
A novel reprogrammable interconnect architecture with decoded RAM storage
Proceedings of IEEE Custom Integrated Circuits Conference - CICC '94 · 1994
5
cited
Experimental characterization and model validation of thermal hot spots in 3D stacked ICs
International Workshop on Thermal Investigations of ICs and Systems · 2010
4
cited
Investigation of tier-swapping to improve the thermal profile of memory-on-logic 3DICs
International Workshop on Thermal Investigations of ICs and Systems · 2010
4
cited
Non-orthogonal decoding: An architectural element for reprogrammable interconnect or logic
Proceedings of Custom Integrated Circuits Conference · 1996
3
cited
Test circuit for an asic
1998
Thermal Modeling and 3 D A Practical Approach to Thermal Modeling and Validation of 3 D ICs
2010
Sotabase
Adi Srinivasan | Researcher Profile | Sotabase | Sotabase